A new wafer technology was developed by Mosaic

The company said its process uses microscopic current conductors deposited on a wafer, rather than wires to link chips together. Troy, Mich.-based Mosaic Systems said the development can make it possible to “build much smaller, faster and more powerful computers and to manufacture them at a lower cost.� The company described the wafer as miniaturized circuit board in which chip-to-chip signals travel only very short distances.